NCG is The Non Contact Gauge. DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below. Avoidance wafer breakage risk by the thickness measurement

 — This paper proposes an automatic tool setting method for grinding internal screw threads with non-contact proximity switch, which can be effectively applied into realistic situation with low cost. The geometrical features of internal screw threads in the narrow space are measured by non-contact proximity switch and used to determine the …

DOI: 10.1016/J.PROMFG.2017.09.080 Corpus ID: 139649002; Non-contact measurement of grinding pins by means of a 2D laser micrometer @article{Valio2017NoncontactMO, title={Non-contact measurement of grinding pins by means of a 2D laser micrometer}, author={Gonzalo Vali{~n}o and Roman Wdowik and Jacek Misiura and Pablo Zapico}, …

machine structure during wheel contact in the grinding and dressing processes. The user can set up the system easily, and immediately reap ... Non-Contact External/ Internal SB-5501-N SB-5511-N SB-5521-N SB-5531-N Hydro Balancer SB-5501-H SB-5511-H SB-5521-H SB-5531-H

 — In the present paper, prediction, sensitivity analysis and adaptive control of collaborative tooth flank grinding considering both geometric accuracy and local bearing contact evaluations is developed for non-orthogonal aerospace spiral bevel gears, in order to distinguish with the conventional grinding only considering the tooth flank ...

The results show that non-contact ultrasonic grinding of sapphire wafer can reduce the surface roughness by 48.6% and the material removal amount was 12.9 mg. Compared with traditional contact grinding, the results show that non-contact ultrasonic grinding was better in reducing the surface roughness and improving the processing efficiency of ...

Microscopic images of surfaces can be used for non-contact roughness measurement by visual methods. However, the images are usually acquired manually and need to be as sharp as possible, which limits the general application of the method. This manuscript provides an automatic roughness measurement method that can apply to automatic …

 — The non-uniform contact behavior actually existed between bearing raceway and grinding wheel during ELID groove grinding process, the following conclusions are drawn from these studies. (1) Variety of feeding speed forms circumstance under which the interaction phenomenon takes place.

 — The paper presents the results of contact and non-contact measurements of external profiles of selected grinding pins. The measurements were conducted in order to choose the appropriate measuring ...

 — A grinding wheel is a precision tool with thousands of cutting points on its surface - abrasive grains that are held in place by a bond matrix (hence these are known as bonded abrasives) and separated by pores.. These pores are hollow spaces between abrasive grains and the bond, which help with the clearance of discarded metal chips in …

 — This study develops pure electrical discharge machining as an alternative for non-contact wafer grinding and thinning to achieve high precision and low cost. This method employs a copper-made rotary cup wheel as the tool electrode to replace the conventional diamond wheel to realize electrical discharge grinding. A prototype is built to ...

 — Non-contact grinding/thinning of silicon carbide wafer by pure EDM using a rotary cup wheel electrode. Junming Guan, Yonghua Zhao. Published in Precision …

 — This study develops pure electrical discharge machining as an alternative for non-contact wafer grinding and thinning to achieve high precision and low cost. This method employs a copper-made ...

This paper presents the cylindrical part profile using a laser scanning micrometer (LSM) device with diameter range (0.2 to 40) mm, diameter resolution 0.05 µm, motion range axial to 300 mm. Experimental profiles measured in some detail sectional aluminum cylinder, measured profile results are equivalent measured on the industrial round gauge F135 of …

 — Grind only on the face of a straight wheel. Grind only on the side of a cylinder, cup or segment wheel. Make grinding contact gently, without bumping or gouging. Never force grinding so that the motor slows noticeably or the work gets hot. The machine ampmeter can be a good indicator of correct performance.

 — Our proprietary EZPunch™ and EZCam™ software allows for simple Non-Round process development and is designed for machine operator use. If you have an application that might benefit from Non-Round grinding, please contact us.We will develop and demonstrate a complete grinding process specifically for your part.

 — The angles at which the centerless grinding wheels contact the part are critical to achieving the proper roundness and tolerance. ... Dopants raise the recrystallization temperature of tungsten wire and other wires, giving non-sag properties to tungsten light bulb filaments and other products. Read Content.

Coordinate Measuring Machines X-ray CT system Surface Texture and Contour Measuring Instruments Non-contact Surface Texture and Contour Measuring Instruments/Systems Optical shaft measuring system …

 — The paper presents the results of contact and non-contact measurements of external profiles of selected grinding pins. The measurements were conducted in order to choose the appropriate measuring ...

Non-contact grinding/thinning of silicon carbide wafer by pure EDM using a rotary cup wheel electrode Precision Engineering 10.1016/j.precisioneng.2021.12.001

Optimization of the SiC with respect to fuel performance involves four areas of study: (a) characterization of as-deposited SiC coatings; (b) thermodynamics and kinetics of …

 — The present work proposes the use of a 2D laser micrometer to perform on-machine macrogeometric measurement and analysis of grinding pins in order to …

 — The games below which come from both the west and the east all manage to avoid grinding. Either they balance the game well enough to make grinding unnecessary, or the progression system makes it simply impossible to do so. Hopefully, those who ignore the genre will find something they like here if they have not already played it.

 — Compared with traditional contact grinding of sapphire wafer under certain pre-pressure conditions, the experimental results show that non-contact ultrasonic …

JUCRANK - Non-cylindrical grinding machines Precise in a single set-up. The JUCRANK non-cylindrical grinding machine accomplishes all grinding tasks on crankshafts. Maximum accuracy and quick cycle times are achieved through oscillation grinding in a single clamping set-up and through the productive machine concept.

This paper proposes a non-contact ultrasonic grinding processing method, which can effectively avoid the phenomenon of grinding tool wear on the workpiece due to the …

 — Owing to the non-contact property of the PLDDS and the CS, there is no additional force introduced into following measurements. ... Chatter stability of metal cutting and grinding. CIRP Annals, 53 (2) (2004), pp. 619-642. View PDF View article View in Scopus Google Scholar [8]

 — This paper proposes a non-contact ultrasonic grinding processing method, which can effectively avoid the phenomenon of grinding tool wear on the workpiece due …

 — The result showed that non-contact ultrasonic grinding of the sapphire wafer could reduce the surface roughness by 48.6%. Compared with traditional contact grinding of sapphire wafer under certain ...

 — This study develops pure electrical discharge machining as an alternative for non-contact wafer grinding and thinning to achieve high precision and low cost. This method employs a copper-made ...